Laser Marking Machine
Detailed
■ CO2 Parameters
Laser brand | Laser type | Laser wave length | Laser power |
American up-and-comers | CO2 | 10.6UM | 10W |
Laser cooling method | Laser code cycle | Spot diameter | Zigzag mirror |
Forced air cooling | 0.1-0.6S/ Single code | 3.2MM±0.2 | Eurasian |
PCB passes through the height | Track width adjustment | Headlight industry serial number management system | Barcode management system |
UP:10MM DOWN:10MM | Automatic | Automatic | Self-development |
■ UV Parameters
Laser brand | Laser type | Laser wave length | Laser power |
IPG | Ultraviolet | 355NM | 5W |
Laser cooling method | Laser code cycle | Spot diameter | Zigzag mirror |
Forced air cooling | 0.1-0.8S/ Single code | 3.2MM+0.2 | Eurasian |
PCB passes through the height | Barcode management system | ||
UP:10MM DOWN:10MM | Automatic |
■ FIBER Parameters
Laser brand | Laser type | Laser wave length | Laser power |
IPG | Fiber-optical | 1064NM | 20W |
Laser cooling method | Laser code cycle | Spot diameter | Zigzag mirror |
Forced air cooling | 0.5-0.85/3 * 3MM single code | 6-9MM | Eurasian |
PCB passes through the height | Barcode management system |
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UP:20MM DOWN:20MM | Standard configuration |
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■ Same specifications
Filed lens | Label the card | Operate mode | Orientation system |
Wavelength | The golden orange | LASER shift | CCD+MARK positioning |
Barcode detection | PCB maximum dimensions | PCB thickness | Track mode and transmission direction |
CCD online testing | 50MM50MM~460MM510MM | 0.5MM-8MM | Monorail, left to right |
Guide brand | Motor brand | Motor control | Air cylinder |
HIWIN | Mitsubishi | Ressaix | Yadeke |
Electromagnetic valve | Sensor | Camera | Source |
SMC | OMRON | Hikvision | Ming Wei |
MES port | Automatic pedal system | Same play, same read system | Grade recognition system |
Come into bloom | Apolegamy | Apolegamy | Apolegamy |
Industrial control host | Operating system | Factory report | Input voltage |
Advantech | WINDOWS 10 | CMK | AV220V 50/60HZ |
Air pressure source | Environmental requirements | Device power | Equipment size (length * width * height) |
≥0.5MPA | 5~40℃, 30~80RH | 2.5KVA | 1100 * 1730 * 1700MM |
Keywords:
Hardware
Laser Marking Machine
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