Smart BGA Rework Station

■ Smart BGA Rework Station Parameters

■ Product Features

• The machine uses touch screen human-machine interface, heating time, heating temperature, heating speed, cooling time, early alarm, vacuum time and so on are all set inside the touch screen, the operation is intuitive, simple and easy to use.
• The serial machine is independently controlled by the Panasonic PLC imported from Japan and the temperature control module of Dalian University of Technology. It displays three temperature curves at any time, and has four independent temperature measurement interfaces.It can accurately judge the temperature of multiple points of the chip, so as to ensure the soldering yield of the chip;
• Three temperature zones are heated independently, and the heating temperature, heating time and heating slope can be set independently in each temperature zone; eight heating temperature sections simulate the reflow soldering heating mode, and can be set respectively [preheating, holding, heating, welding, reflow, cooling];
• The machine has the function of automatic feeding, suction and discharge; it can automatically identify the center position of the chip when positioning;
• There are four modes [welding, unloading, mounting and manual] for multi-functional mode selection, which can realize automatic and semi-automatic functions to better meet the needs of customers;
• Using high precision K type thermocouple closed loop control imported from the United States, combined with our unique heating method, to ensure the welding temperature difference is ±1℃;
• The machine adopts imported optical alignment system, equipped with 15-inch HIGH-DEFINITION display; high precision micrometer is selected for X/Y/R axis adjustment; the alignment accuracy is controlled in 0.01-0.02MM;
• In order to ensure the accuracy of the positioning, the upper heating head and mounting head are integrated design; the machine is equipped with a variety of specifications BGA heating nozzle, better meet the needs of customers for a variety of chips, heating nozzle is easy to replace, special requirements can be customized;
• High automation and precision, completely avoid human error; for lead-free process and double-layer BGA, QFN, QFP, capacitor resistance and other components can achieve the best effect;
• Side monitoring camera, which can be used to observe the melting of solder balls, so as to determine the curve and welding effect (this function is optional)