Smart BGA Rework Station
Detailed
■ Smart BGA Rework Station Parameters
| PCB dimensions | MAX 570×450mm, MIN 10×10mm | Mounting accuracy | ±0.01mm |
| PCB thickness | 0.3-8mm | Minimum spacing | 0.15mm |
| Applicable chip | MAX 100×100mm MIN 1×1mm (customizable) | Bottom preheating | Far infrared 4200W |
| Workbench fine adjustment | Front and back: ±15 mm, Left and right: ±15 mm | Upper hot-air heating | Hot air 1600W |
| Temperature control | High-precision K-type thermocouple closed-loop control, with independent upper and lower temperature measurement, achieving temperature accuracy of ±1°C. | Lower hot-air heating | Hot air 1600W |
| PCB positioning method | V-shaped card slot + universal clamp | Heaviest chip | 150g |
| Temperature measurement interface | 4 pieces | Machine weight | Approximately 75 kg |
| Use power supply | AC 220V, 50/60 Hz | Machine external dimensions | L660*W670*H920mm |
■ Product Features
| ❆ This machine features a touch-screen human–machine interface, with all parameters—including heating time, heating temperature, heating rate, cooling time, early‑warning alerts, and vacuum duration—configured directly on the screen. Operation is intuitive, straightforward, and easy to learn. |
| ❆ This machine is equipped with a Japan‑imported Panasonic PLC and an independently controlled Dalian University of Technology temperature‑control module, providing real-time display of three temperature profiles and four independent temperature‑sensing interfaces. It enables precise temperature measurement at multiple points on the chip, thereby ensuring high soldering yield. |
| ❆ Three independent temperature zones with separate heating; each zone allows independent setting of heating temperature, heating time, and ramp rate. Eight distinct heating stages simulate the reflow soldering process, with programmable settings for preheat, soak, ramp-up, soldering, reflow, and cooling. |
| ❆ This machine is equipped with automatic feeding, material suction, and material discharge functions; during alignment, it can automatically detect the chip’s center position. |
| ❆ Multi‑function mode selection offers four modes—welding, removal, mounting, and manual—enabling both automatic and semi‑automatic operation to better meet a wide range of customer needs. |
| ❆ Employing a high-precision, U.S.-imported K-type thermocouple for closed-loop control, combined with our company’s proprietary heating method, ensures that the welding temperature variation remains within ±1°C. |
| ❆ This machine features an imported optical alignment system and is equipped with a 15-inch high-definition display. It employs a high-precision micrometer for X/Y/R-axis adjustment, ensuring alignment accuracy within 0.01–0.02 mm. |
| ❆ To ensure precise alignment, the upper heating head and the placement head are integrated into a single unit. The machine is equipped with BGA rework nozzles of various specifications, enabling it to better meet customers’ diverse component‑mounting requirements. The nozzles are easy to interchange, and custom configurations can be provided upon request. |
| ❆ Highly automated and precise, it completely eliminates human‑induced operational errors; it delivers optimal results for lead‑free processes and the rework of components such as double‑layer BGAs, QFNs, QFPs, capacitors, and resistors. |
| ❆ Side‑view monitoring camera, enabling observation of solder ball melting to facilitate assessment of the curve and soldering quality (this feature is optional). |
Keywords:
Hardware
Intelligent BGA Rework Station
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