Fully Automatic BGA Rework Station

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Product Specifications

Model number JM-W D S‑1800 JM-W D S‑2000
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Positioning Precision Industrial Control / 5G Server Motherboard Rework High-power, industrial-grade, high-precision rework
Heating method Top hot air + bottom hot air + infrared preheating at the base
Temperature zone Independent three-zone temperature control
Control system Industrial all-in-one PC + PLC + Touch Screen
Opposition High-definition industrial camera with fully automatic alignment
Drive Independent eight-axis simultaneous control Multi-axis motor coordination
Applicable chips BGA/POP/CCGA/QFN/CSP/LGA, etc.
Featured Features Suction rod with air-blowing cooling, 5 temperature measurement ports High-power, large-size PCB compatibility
Power supply AC 220V ±10% / 50/60 Hz
Maximum set temperature ≤350℃
Heating rate Up to 10°C/s
Temperature control curve 10 heating/cooling segments + 10 constant-temperature segments
Upper hot air Dual-channel, outlet diameter Φ80mm High-Power Hot-Air System
Nozzle pressure Minimum 90g, zero-pressure suction adhesion High-precision micro-pressure control
Temperature measurement port 5 items Multi-port temperature measurement
Nitrogen interface There is
Installation space Back side ≥ 300 mm

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