Fully Automatic BGA Rework Station
Detailed
■ Product Specifications
| Model number | JM-W D S‑1800 | JM-W D S‑2000 |
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| Positioning | Precision Industrial Control / 5G Server Motherboard Rework | High-power, industrial-grade, high-precision rework |
| Heating method | Top hot air + bottom hot air + infrared preheating at the base | |
| Temperature zone | Independent three-zone temperature control | |
| Control system | Industrial all-in-one PC + PLC + Touch Screen | |
| Opposition | High-definition industrial camera with fully automatic alignment | |
| Drive | Independent eight-axis simultaneous control | Multi-axis motor coordination |
| Applicable chips | BGA/POP/CCGA/QFN/CSP/LGA, etc. | |
| Featured Features | Suction rod with air-blowing cooling, 5 temperature measurement ports | High-power, large-size PCB compatibility |
| Power supply | AC 220V ±10% / 50/60 Hz | |
| Maximum set temperature | ≤350℃ | |
| Heating rate | Up to 10°C/s | |
| Temperature control curve | 10 heating/cooling segments + 10 constant-temperature segments | |
| Upper hot air | Dual-channel, outlet diameter Φ80mm | High-Power Hot-Air System |
| Nozzle pressure | Minimum 90g, zero-pressure suction adhesion | High-precision micro-pressure control |
| Temperature measurement port | 5 items | Multi-port temperature measurement |
| Nitrogen interface | There is | |
| Installation space | Back side ≥ 300 mm | |
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