Manufacturing Execution System (MES)
Detailed
■ Product Introduction
The MES intelligent material production system focuses on the precison management of the manufacturing process. Covering process management, planning cushion, section-based process operations, material management, quality management and other levels. Through integration with production equipment, real-time collection of production data, provide report center and kanban center, realize the transparency and traceability of the production process, to ensure the efficient implementation of the production plan.
■ Manufacturing Execution System (MES)

■ Key Focus Areas of MES for Electronics Assembly

| * Laser Engraving Machine |
|---|
| PCB unpacking / work order management: 1. PCB Vendor; 2. PCB P / ND / C LOT; 3. PCB unpacking time (The starting time of exposure of a PCB to the environment after removal from a moisture-proof package.) |
| * Printer |
| Management of anchor paste model and printing tools: 1. Control of anchor paste model and validity period of online use; 2. Cycle Control of printed steel plate model and steel plate cleaning; 3. Cycle Control of sharp knife model and maintenance cleaning. |
| * SPI |
| Statistically analyze the adverse cause and location of SPI by testing system data (SPI support data export). |
| * Chip Mounter, Universal Chip Mounter |
Material error prevention and traceability management of chip mounter: 1. Comparison control of feeding operation; 2. Compulsory comparison control of feeder refill process; 3. Control of typing machine program and work order scheduling; 4. Lock machine in abnormal state (equipment shutdown): 5. Product traceability query; SMT operation intelligent assistance early warning mechanism: 1. Warning of material change for production line machine; 2. Intelligent early warning & shutdown alert when machine is out of material; 3. Intelligent early warning & shutdown alert when feeding times reach maintenance; 4. Disabled material warning. |
| * Pre-reflow AOI and Post-reflow AOI |
| Testing system data of AOI bad causes, statistical analysis of bad position (AOI support data export). |
| * Reflow |
| PCB tin paste printing time registration and furnace shelf period control (to prevent the stay time of PCB paste in the production line from exceeding the control time, resulting in abnormal welding quality). |
| * Component Insertion Machine |
| Manual component logging and PCB material binding. |
| * Wave Soldering |
| Registration and management of wave soldering defects. |
| * Assemble |
| Registration for assembly and PCB material binding. |
| * Function Testing |
| Registration and management of bad functional tests. |
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Software
Manufacturing Execution System (MES)
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