Manufacturing Execution System (MES)
Detailed
■ Product Introduction
The MES, or Manufacturing Execution System, focuses on granular management of the production process, encompassing process flow management, planning and scheduling, shop-floor operations, material management, quality control, and more. By integrating with production equipment, it captures real-time production data and provides a reporting hub and a dashboard portal, enabling transparency and traceability throughout the manufacturing process and ensuring efficient execution of production plans.
■ Manufacturing Execution System (MES)
■ Key Focus Areas of On-Site Manufacturing Management in Electronic Assembly MES
| * Laser engraving machine |
|---|
| PCB Unboxing/Work Order Management: 1. PCB Vendor, 2. PCB Part Number, Date Code, Lot Number, 3. PCB Unboxing Time (from unboxing to end of production control) |
| * Printer |
| Solder Paste Management and Printing Tool Control: 1. Control of solder paste types and their shelf‑life for on‑line use; 2. Control of stencil plate types and the cleaning cycle for stencils; 3. Control of squeegee types and their maintenance and cleaning schedule. |
| * SPI |
| Statistical analysis of test system data: analysis of SPI defect causes and defect location statistics (SPI supports data export). |
| * Chip mounter, universal pick-and-place machine |
| Material error-proofing and traceability management for pick-and-place machines: 1. Material‑feeding operation comparison and control; 2. Material‑replenishment operation mandatory comparison and control; 3. Machine‑program and work‑order scheduling control; 4. Machine locking in case of abnormal status (equipment shutdown); 5. Product traceability and query. SMT Operation Intelligent Assistance and Early Warning Mechanism: 1. Material change alert for production line equipment programs; 2. Intelligent shutdown warning when equipment is out of materials; 3. Intelligent shutdown warning upon reaching the maintenance threshold for feeder usage; 4. Material shortage alert. |
| * Pre-furnace AOI, Post-furnace AOI |
| Test system data statistical analysis of AOI defect causes and defect location statistics (AOI supports data export). |
| Reflow |
| PCB solder paste printing time logging and pre‑furnace shelf-life control (to prevent the solder paste on PCBs from remaining on the production line longer than the specified time limit, which could lead to soldering quality issues) |
| * Plugin machine |
| Component Material Registration and PCB Bill of Materials Binding |
| * Wave soldering |
| Wave Soldering Defect Registration and Management |
| * Assembly |
| Assembly Material Registration and PCB Material Binding |
| * Functional testing |
| Functional Test Defect Registration and Management |
Keywords:
Software
Manufacturing Execution System (MES)
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